产品规格书/Specification
|
产品/product: |
介质浆料/ Dielectric paste |
|
料号/part number: |
07HGT90 |
适用范围/Application:
该款浆料适合于厚膜电路多层布线隔离介质浆料。
The paste is Alumina substrate thick film circuit multilayer insulating dielectric paste.
使用条件/Operating conditions：
|
基材 Substrate |
厚膜电路,氧化铝陶瓷,氧化锆陶瓷 thick film circuit，alumina ceramic |
|
使用方法 Method of use |
印刷，200-250目 Printing, 200-250mesh |
|
流平 Levelling |
5-10min minutes at room temperature 室温下流平5-10分钟（时间根据流平的实际情况决定）。 |
|
烘干 Curing conditions |
通风烘箱烘烤100-150℃，10-15分钟 （空考温度低于300℃，可根据烘烤的实际情况决定烘烤时间。） 100-150℃ 10-15 min |
|
烧结 Firing Condition |
隧道炉空气气氛下烧结，峰值1050℃（推荐值），10分钟。 Atmospheric firing in belt furnace with peak time of 10 Minutes at 1050℃ |
|
稀释剂 Thinner |
ST-1001 |
性能/Characteristics：
1. 浆料性能/Paste Characteristics：
|
性能Characteristic |
标准Standard |
测试方法及条件 Test method and conditions |
|
|
1 |
细度 Fineness |
≤8μm |
FOG test |
|
2 |
粘度Viscosity |
100~200Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25±1℃ |
|
3 |
Appearance 外观 |
无色， Transparent |
|
2. 烧结后特性/Characteristics after curing：
在1烧结条件下，Check fired film produced under the conditions specified in 1）,
|
Characteristics |
Standard |
Test method and conditions |
|
|
4 |
外观 Appearance |
紧凑，致密 Compact and Dense |
目视 Eyeballing |
|
5 |
Capacitance of unit |
≤3.0PF/mm2 |
KT2618 type |
|
6 |
Wastage of insulation |
＜1% |
KT2618 type |
|
7 |
绝缘电阻 Resistance of insulation |
＞109Ω（500VDC, 25℃） |
RCJ-3 type |
|
8 |
击穿电压 Breakdown voltage |
＞2000VAC, 25℃ |
CS2673A type |
|
9 |
介质常数 Constant insulation(ε) |
9～15 |
Calculation |
保存条件，有效期/Storage condition and Term of validity
产品应在5-15℃的环境温度下密封储存，有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃
包装方式/Packaging method：
标准包装，1000g/罐, 样品可提供200克小罐包装
Standard package 1000g/can，if you need sample to test, available 200g with small package.
