产品规格书/Specification
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产品/product: |
介质浆料/ Dielectric paste |
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料号/part number: |
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适用范围/Application:
This specification applies to thick film package paste.
该浆料适合于外层包封、芯片固定、粘结等。
使用条件/Operating conditions：
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基材 Substrate |
厚膜电路、玻璃、陶瓷、金属等 thick film circuit, glass, ceramic, metal, etc. |
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使用方法 Method of use |
印刷，200-250目 Printing, 200-250mesh |
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流平 Levelling |
5-10min minutes at room temperature 室温下流平5-10分钟（时间根据流平的实际情况决定）。 |
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固化 Curing conditions |
通风烘箱烘烤150~200℃，20-30分钟 (固化温度可以在150 150~ ( It could be cured at a temperature between 150~ |
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稀释剂 Thinner |
ST-1001 |
性能/Characteristics：
1. 浆料性能/Paste Characteristics：
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性能Characteristic |
标准Standard |
测试方法及条件 Test method and conditions |
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1 |
细度 Fineness |
≤8μm |
FOG test |
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2 |
粘度Viscosity |
80~150Pa.s |
Brookfield HBT utility cup and spindle(SC4-14/6R),10rpm, 25± Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25± |
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3 |
Appearance 外观 |
无色 gray |
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2. 烧结后特性/Characteristics after curing：
在1烧结条件下，Check fired film produced under the conditions specified in 1）,
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特性 Characteristics |
Standard 标准 |
测试方法和条件 Test method and conditions |
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4 |
Acid resistance 耐酸性 |
Fine 良好 |
Marinate in 5% H2S04, 30mins, no difference with standard sample 5%硫酸，30分钟无变化 |
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5 |
Insulation resistance 绝缘系数 |
≥10 4MΩ |
RCJ-30 |
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6 |
Breakdown voltage 击穿电压 |
≥300V |
CS |
保存条件，有效期/Storage condition and Term of validity
产品应在5-15℃的环境温度下密封储存，有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5
包装方式/Packaging method：
标准包装，
Standard package
