产品规格书/Specification
产品/product: |
焊线导电银浆/ Drawing wire silver paste |
料号/Part number: |
01H-6301 |
适用范围/Application:
此产品适用电热片、厚膜电路、陶瓷、玻璃等需要引出导线、耐高温的电子器件,可耐800度以下高温。
Suitable for drawing wires, can be endure high temperature less than 800℃。.
使用条件/Operating conditions:
基材 Substrate |
陶瓷、玻璃等电路、电子器件 Ceramic, ceramic glass etc. |
点胶
|
200-300目丝网印刷 200-300 mesh stainless screen |
流平 Levelling |
5-15min minutes at room temperature 室温下流平5-15分钟(时间根据流平的实际情况决定)。 |
干燥 Drying |
通风烘箱烘烤100-150℃,10-15分钟 (空考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。) 100-150℃ 10-15 min |
烧结 Firing Condition |
隧道炉空气气氛下烧结,烧结最高温度600~900℃(推荐值),10分钟。 Atmospheric firing in belt furnace with peak time of 10 Minutes at 600~900℃ |
Thinner |
ST-1000 |
性能/Characteristics:
1. 浆料性能/Paste Characteristics:
性能Characteristic |
标准Standard |
测试方法及条件 Test method and conditions |
|
1 |
Fineness |
≤5μm |
FOG test |
2 |
Viscosity |
200-580Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃,
Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
3 |
固体含量 |
85~95% |
|
2. 烧结后特性/Characteristics after firing:
在1烧结条件下,膜厚8-12mm Check fired film produced under the conditions specified in 1), (Film thickness is 8-12mm.)
特性 Characteristics |
Standard 标准 |
测试方法和条件 Test method and conditions |
|
3 |
Resistivity 方阻 |
≤3mΩ/□ |
Test pattern 0.6mm×60mm 测试图形0.6mm×60mm |
4 |
Adhesion strength 附着力 |
|
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 0.5mmφ锡浸铜线,焊接面积2mm×2mm Solder: 96.5Sn/0.5Cu Mildly activated flux used. 焊料:96.5Sn/0.5Cu |
Initial 初始附着力 |
≥45.2N |
|
|
Ageing 老化附着力 |
≥24.6N |
Ageing: 150℃×24hrs 老化条件:150℃,24小时 |
保存条件,有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
包装方式/Packaging method:
标准包装,1000g/罐, 样品可提供200克小罐包装
Standard package 1000g/can,if you need sample to test, available 200g with small package.