银浆
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产品规格书/Specification

 

产品/product:

填孔导电银浆/ Through hole Silver paste

料号/Part number:

01H-5901

 

 

适用范围/Application:

此产品适用于LTCC,LED等陶瓷电路填孔使用。

Suitable for LTCCLED etc, Ceramic circuit through hole.

 

 

使用条件/Operating conditions

基材

Substrate

陶瓷电路

Ceramic circuit

印刷

Printing

丝网印刷

Screen printing

流平

Levelling

5-15min minutes at room temperature

室温下流平5-15分钟(时间根据流平的实际情况决定)。

干燥

Drying

通风烘箱烘烤100-150℃,10-15分钟

(空考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。)

100-150  10-15 min

烧结

Firing Condition

隧道炉空气气氛下烧结,峰值850(推荐值),10分钟。

(可根据实际需要,烧结范围可在800-850℃内调节,但峰值温度时间必须10分钟。)

Atmospheric firing in belt furnace with peak time of 10 Minutes at 850

Thinner

ST-1000

 

性能/Characteristics

1. 浆料性能/Paste Characteristics

性能Characteristic

标准Standard

测试方法及条件

Test method and conditions

1

Fineness

5μm

FOG test

2

Viscosity

200-580Pa.s

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

粘度可根据用户实际需要调节。

 

2. 烧结后特性/Characteristics after firing

1烧结条件下,膜厚8-12mm Check fired film produced under the conditions specified in 1, (Film thickness is 8-12mm.)  

 

 

 

特性

Characteristics

Standard

标准

测试方法和条件

Test method and conditions

3

Resistivity

方阻

 

5mΩ/□

Test pattern 0.6mm×60mm

测试图形0.6mm×60mm

 

 

保存条件,有效期/Storage condition and Term of validity

产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25

 

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

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