介质浆料
  • 产品详情

产品规格书/Specification

产品/product:

介质浆料/ Dielectric paste

料号/part number:

07MT-FD46

适用范围/Application:

该款浆料适合于厚膜电路填孔、器件粘合等,可用于陶瓷、玻璃,金属等基材。

The paste is suitable for through hole into thick film circuitceramicglassmetal.

使用条件/Operating conditions

基材

Substrate

厚膜电路,氧化铝陶瓷,陶瓷、玻璃, 金属

thick film circuitalumina ceramicglass, metal

使用方法

Method of use

网孔印刷,

Printing,

流平

Levelling

5-10min minutes at room temperature

室温下流平5-10分钟(时间根据流平的实际情况决定)。

烘干

Curing conditions

通风烘箱烘烤100-150℃,10-15分钟

(烘烤考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。)

100-150  10-15 min

烧结

Firing Condition

隧道炉空气气氛下烧结,峰值450±10(推荐值,最低400度可玻璃化),10~30分钟。

(可根据实际需要,烧结范围可在390-580℃内调节,但峰值温度时间必须10分钟以上,烧结温度偏低时,峰值时间适当延长直到玻璃化完成,一般建议30分钟左右

Atmospheric firing in belt furnace with peak time of 10~30 Minutes at 450±10

According to actual needs, sintering range can be adjusted within 400-580℃)

稀释剂

Thinner

ST-1001

性能/Characteristics

1. 浆料性能/Paste Characteristics

性能Characteristic

标准Standard

测试方法及条件

Test method and conditions

1

细度

Fineness

≤8μm

FOG test

2

粘度Viscosity

350~500Pa.s

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

3

Appearance

外观

无色

Transparent

 

 

2. 烧结后特性/Characteristics after curing

1烧结条件下,Check fired film produced under the conditions specified in 1,

特性

Characteristics

Standard

标准

测试方法和条件

Test method and conditions

4

外观

Appearance

紧凑致密

compact

目测&显微镜

Visual inspect & microscope

       

保存条件,有效期/Storage condition and Term of validity

产品应在5-15℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

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