包封浆料
  • 产品详情

 

 

产品规格书/Specification

 

产品/product:

包封浆料/ package paste

料号/part number:

09L-4406

适用范围/Application:

该款浆料适合于电路、电阻片外封标识,外层包封,可用于玻璃、陶瓷、不锈钢、铝合金等基材

The paste is suitable for marking thick film circuit and outside package,  glass, ceramic, metal, etc.  

 

使用条件/Operating conditions

基材

Substrate

厚膜电路、玻璃、陶瓷、金属等

thick film circuit, glass, ceramic, metal, etc.

使用方法

Method of use

印刷,200-250

Printing, 200-250mesh

流平

Levelling

5-10min minutes at room temperature

室温下流平5-10分钟(时间根据流平的实际情况决定)。

固化

Curing conditions

通风烘箱烘烤150~200℃,20-30分钟

(固化温度可以在150-200范围内,固化时间可根据实际情况决定)

150~200, 20-30 min

( It could be cured at a temperature between 150~ 200°C, but it depends of the thickness and the substrate.)

稀释剂

Thinner

ST-1001

 

性能/Characteristics

1. 浆料性能/Paste Characteristics

性能Characteristic

标准Standard

测试方法及条件

Test method and conditions

1

细度

Fineness

≤8μm

FOG test

2

粘度Viscosity

80~150Pa.s

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

3

Appearance

外观

白色,黑色,蓝色,绿色

white, blackblue, green

 

 

2. 烧结后特性/Characteristics after curing

1烧结条件下,Check fired film produced under the conditions specified in 1,

特性

Characteristics

Standard

标准

测试方法和条件

Test method and conditions

4

Acid resistance

耐酸性

Fine

良好

Marinate in 5% H2S04, 30mins,

no difference with standard sample

5%硫酸,30分钟无变化

 

5

Insulation resistance

绝缘系数

----

RCJ-30

6

Breakdown voltage

击穿电压

----

CS262673A

 

 

保存条件,有效期/Storage condition and Term of validity

产品应在5-15℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃

 

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

 

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