介质浆料
  • 产品详情

 

 

产品规格书/Specification

 

产品/product:

包封浆料/ package paste

料号/part number:

07M-SL31

 

 

适用范围/Application:

该款浆料适合于厚膜电路包封

The paste is suitable for coating thick film circuit.

 

使用条件/Operating conditions

基材

Substrate

厚膜电路,氧化铝陶瓷

thick film circuitalumina ceramic

使用方法

Method of use

印刷,200-250

Printing, 200-250mesh

流平

Levelling

5-10min minutes at room temperature

室温下流平5-10分钟(时间根据流平的实际情况决定)。

烘干

Curing conditions

通风烘箱烘烤100-150℃,10-15分钟

考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。)

100-150  10-15 min

烧结

Firing Condition

隧道炉空气气氛下烧结,峰值550±10(推荐值),10分钟。

(可根据实际需要,烧结范围可在530-650℃内调节,但峰值温度时间必须10分钟。)

Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 550±10

According to actual needs, sintering range can be adjusted within 530-650℃)

稀释剂

Thinner

ST-1001

 

 

性能/Characteristics

1. 浆料性能/Paste Characteristics

性能Characteristic

标准Standard

测试方法及条件

Test method and conditions

1

细度

Fineness

8μm

FOG test

2

粘度Viscosity

100~200Pa.s

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

3

Appearance

外观

透明,黑色,蓝色,绿色

Transparent, black, blue, green

 

 

 

 

 

2. 烧结后特性/Characteristics after curing

1烧结条件下,Check fired film produced under the conditions specified in 1,

特性

Characteristics

Standard

标准

测试方法和条件

Test method and conditions

4

外观

Appearance

紧凑致密

compact

目测&显微镜

Visual inspect & microscope

 

 

保存条件,有效期/Storage condition and Term of validity

产品应在5-15℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃

 

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

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