- 产品详情
产品规格书/Specification
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产品/product: |
银钯浆料/ Ag/Pd paste |
|
料号/Part number: |
02H-1805 |
适用范围/Application:
此产品适用于厚膜电路、传感器。
Suitable for chip resistor、thick film circuit electrode.
使用条件/Operating conditions：
|
基材 Substrate |
氧化铝陶瓷 Alumina ceramic |
|
印刷 Printing |
200-300目丝网印刷 200-300 mesh stainless screen |
|
流平 Levelling |
5-15min minutes at room temperature 室温下流平5-15分钟（时间根据流平的实际情况决定）。 |
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干燥&烧结 Drying &Sintering |
通风烘箱烘烤100-150℃，10-15分钟 100-150℃ 10-15 min 隧道炉空气气氛下烧结，峰值850℃（推荐值），10分钟。 Atmospheric firing in belt furnace with peak time of 10 mins at 850℃ |
|
Thinner |
ST-1000 |
性能/Characteristics：
1. 浆料性能/Paste Characteristics：
|
性能 Characteristic |
标准 Standard |
测试方法及条件 Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
130-280Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
2. 烧结后特性/Characteristics after firing：
在1烧结条件下，膜厚8-12mm Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12mm.)
|
特性 Characteristics |
Standard 标准 |
测试方法和条件 Test method and conditions |
|
|
3 |
Resistivity 方阻 |
≤10mΩ/□ |
Test pattern 0.6mm×60mm 测试图形0.6mm×60mm |
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4 |
Adhesion strength 附着力 |
|
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 0.5mmφ锡浸铜线，焊接面积2mm×2mm Solder: 96.5Sn/0.5Cu Mildly activated flux used. 焊料：96.5Sn/0.5Cu |
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Initial 初始附着力 |
≥46.5N |
||
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Ageing 老化附着力 |
≥26.7N |
Ageing: 150℃×24hrs 老化条件：150℃，24小时 |
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保存条件，有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存，有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
包装方式/Packaging method：
标准包装，1000g/罐, 样品可提供200克小罐包装
Standard package 1000g/can，if you need sample to test, available 200g with small package.
