银浆
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产品规格书/Specification

产品/product:

导电银浆/ Silver paste

料号/Part number:

01H-4900系列(series

适用范围/Application:

此产品适用于钢化玻璃电极/加热使用。

Suitable for Tempered glass electrode & heating.

使用条件/Operating conditions

基材

Substrate

普通玻璃钢化

Tempered glass

印刷

Printing

200-300目丝网印刷

200-300 mesh stainless screen

流平

Levelling

5-15min minutes at room temperature

室温下流平5-15分钟(时间根据流平的实际情况决定)。

干燥

Drying

通风烘箱烘烤100-150℃,10-15分钟

(空考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。)

100-150℃  10-15 min

烧结

Firing Condition

1. Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 600~750

隧道炉空气气氛下烧结,峰值600~750(推荐值),9-11分钟。

(可根据实际需要,烧结范围可在600-800℃内调节)

2. 可随玻璃钢化是一起成型, 600-750

Sintering with glass tempered together600-750

Thinner

ST-1000

性能/Characteristics

 

01H-4903

01H-4904

01H-4905

01H-4906

01H-4907

01H-4908

01H-4909

Fineness细度(um)

5

5

5

5

5

5

5

Viscosity粘度

(pa.s)

120-180

120-180

120-180

120-180

120-180

120-180

120-150

Silver content银含量(%

80~85

75~80

70~75

65~70

60~65

55~60

50~55

Resistivity方阻

(mΩ/)

3

5

7

10

15

20

30

Adhesion

附着力(N)

55

52

50

48

45

42

40

 

标准

Standard

测试方法及条件

Test method and conditions

Fineness

FOG test

Viscosity

粘度

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

粘度可根据用户实际需要调节。

Resistivity

方阻

Fired film thickness is 8-12mm.)  

烧结膜厚8-12um.

Test pattern 0.6mm×60mm

测试图形0.6mm×60mm

Adhesion strength

附着力

Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 

0.5mmφ锡浸铜线,焊接面积2mm×2mm

Solder: 96.5Sn/0.5Cu Mildly activated flux used.

焊料:96.5Sn/0.5Cu

保存条件,有效期/Storage condition and Term of validity

产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

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