产品规格书/Specification
产品/product: |
导电银浆/ Silver paste |
料号/Part number: |
01M-0605 series |
适用范围/Application:
This Specification applies to piezoceramic conductive paste.
此产品适用于压电陶瓷类产品电极使用
使用条件/Operating conditions:
基材 Substrate |
压电陶瓷,粗糙度3-5u, piezoceramic |
印刷 Printing |
200-300目丝网印刷 200-300 mesh stainless screen |
流平 Levelling |
5-15min minutes at room temperature 室温下流平5-15分钟(时间根据流平的实际情况决定)。 |
干燥 Drying |
通风烘箱烘烤100-150℃,10-15分钟 (烘烤温度低于300℃,可根据烘烤的实际情况决定烘烤时间。) 100-150℃ 10-15 min |
烧结 Firing Condition |
隧道炉空气气氛下烧结,峰值550-750℃(推荐值),9-11分钟。 Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 550-750℃ |
Thinner |
ST-1000 |
性能/Characteristics:
|
01M-0605 |
01M-0607 |
Fineness细度(um) |
≤5 |
|
Viscosity粘度(pa.s) |
120-280 |
|
Solid content固含量(%) |
70-75 |
60-65 |
Resistivity方阻(mΩ/□) |
≤3 |
≤5 |
Adhesion附着力(N) |
≥45 |
≥42 |
Advantages 优点 |
优异的锡焊性能 Excellent soldering performance |
|
标准 Standard |
测试方法及条件 Test method and conditions |
Fineness |
FOG test |
Viscosity 粘度 |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃, Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
Resistivity 方阻 |
Fired film thickness is 8-12mm.) 烧结膜厚8-12um. Test pattern 0.6mm×60mm 测试图形0.6mm×60mm |
Adhesion strength 附着力 |
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 0.5mmφ锡浸铜线,焊接面积2mm×2mm Solder: 96.5Sn/0.5Cu Mildly activated flux used. 焊料:96.5Sn/0.5Cu |
保存条件,有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
包装方式/Packaging method:
标准包装,1000g/罐, Standard package: 1000g/can,
样品装:200克/罐 Sample package: 200g/can