产品规格书/Specification
产品/product: |
导电银浆/ Silver paste |
料号/Part number: |
01H-4205 |
适用范围/Application:
此产品适用于陶瓷电容类产品电极使用
Suitable for ceramic capacitor electrode.
使用条件/Operating conditions:
基材 Substrate |
陶瓷电容 Ceramic capacitor |
印刷 Printing |
200-300目丝网印刷 200-300 mesh stainless screen |
流平 Levelling |
5-15min minutes at room temperature 室温下流平5-15分钟(时间根据流平的实际情况决定)。 |
干燥 Drying |
通风烘箱烘烤100-150℃,10-15分钟 (空考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。) 100-150℃ 10-15 min |
烧结 Firing Condition |
隧道炉空气气氛下烧结,峰值850℃(推荐值),10分钟。 (可根据实际需要,烧结范围可在820-850℃内调节,但峰值温度时间必须10分钟。) Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 850℃ |
Thinner |
ST-1000 |
性能/Characteristics:
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01H-4205 |
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Fineness细度(um) |
≤5 |
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Viscosity粘度 (pa.s) |
120-280 |
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Silver content银含量(%) |
70-75 |
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Resistivity方阻 (mΩ/□) |
≤5 |
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Adhesion 附着力(N) |
≥55 |
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标准 Standard |
测试方法及条件 Test method and conditions |
Fineness |
FOG test |
Viscosity 粘度 |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃, Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
Resistivity 方阻 |
Fired film thickness is 8-12mm.) 烧结膜厚8-12um. Test pattern 0.6mm×60mm 测试图形0.6mm×60mm |
Adhesion strength 附着力 |
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 0.5mmφ锡浸铜线,焊接面积2mm×2mm Solder: 96.5Sn/0.5Cu Mildly activated flux used. 焊料:96.5Sn/0.5Cu |
保存条件,有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
包装方式/Packaging method:
标准包装,1000g/罐, 样品可提供200克小罐包装
Standard package 1000g/can,if you need sample to test, available 200g with small package.